地址:
深圳市龙华区大浪街道恒大时尚慧谷6栋A区11层(总部)
广西南宁市宾阳县岑科产业园(制造中心)
1. 采用低损耗高密度金属粉材料
2. 采用热喷涂技术,电感表面致密性好
3. 闭合磁路设计,更好的抗电磁干扰
4. 高密度压制成型,超高工作电流
5. T core 扁平线工艺,超低直流电阻
1. Utilization of low-loss high-density metal powder materials.
2. Utilization of thermal spraying technology, ensuring excellent surface compactness of the inductor.
3. Closed magnetic circuit design, providing enhanced electromagnetic interference resistance.
4. High-density compression molding, capable of handling extremely high operating currents.
5. T-core flat wire technique, achieving ultra-low direct current resistance.
Applied in tablets, monitors, servers, motherboards,high-power DC/DC modules